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M2S010TS-1FGG484I Tech Specifications

Microsemi  M2S010TS-1FGG484I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 10 Weeks
Package / Case 484-BGA
Supplier Device Package 484-FPBGA (23x23)
Number of I/Os 233I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 166MHz
Base Part Number M2S010TS
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes FPGA - 10K Logic Modules
Flash Size 256KB
RoHS Status RoHS Compliant
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M2S010TS-1FGG484I Documents

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