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JAN1N6109AUS Tech Specifications

Microsemi  JAN1N6109AUS technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Contact Plating Lead, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SQ-MELF, B
Number of Pins 2Pins
Diode Element Material SILICON
Breakdown Voltage / V 13V
Number of Elements 1 Element
Power Dissipation (Max) 5W
Reverse Stand-off Voltage 9.9V
Operating Temperature -55°C~175°C TJ
Packaging Bulk
Series Military, MIL-PRF-19500/516
Published 1997
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Type Zener
Terminal Finish Tin/Lead (Sn/Pb)
Applications General Purpose
Terminal Position END
Terminal Form WRAP AROUND
Qualification Status Qualified
Polarity Bidirectional
Leakage Current 20μA
Element Configuration Single
Case Connection ISOLATED
Power Line Protection No
Current - Peak Pulse (10/1000μs) 27.5A
Clamping Voltage 18.2V
Voltage - Reverse Standoff (Typ) 9.9V
Peak Pulse Current 27.5A
Peak Pulse Power 500W
Direction Bidirectional
Test Current 100mA
Reverse Breakdown Voltage 12.35V
RoHS Status Non-RoHS Compliant
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JAN1N6109AUS Documents

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