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APA300-FG256I Tech Specifications
Microsemi APA300-FG256I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) | |
| Factory Lead Time | 8 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 256-LBGA | |
| Number of Pins | 256Pins | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 400.011771mg | |
| Number of I/Os | 186I/Os | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tray | |
| Series | ProASICPLUS | |
| Published | 2009 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Voltage - Supply | 2.3V~2.7V | |
| Frequency | 180MHz | |
| Base Part Number | APA300 | |
| Operating Supply Voltage | 2.5V | |
| Max Supply Voltage | 2.7V | |
| Min Supply Voltage | 2.3V | |
| RAM Size | 9kB | |
| Total RAM Bits | 73728 | |
| Number of Gates | 300000Gates | |
| Max Frequency | 180MHz | |
| Number of Registers | 8192Registers | |
| Height | 1.2mm | |
| Length | 17mm | |
| Width | 17mm | |
| Radiation Hardening | No | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
APA300-FG256I Documents
Download datasheets and manufacturer documentation for APA300-FG256I
- PCN Design/SpecificationCopper Wire Rev. C 24/Jun/2013 Mult Dev Software Chg 8/Oct/2018
- DatasheetsProASIC-PLUS Flash
- PCN Assembly/OriginMult Devices 29/Mar/2019
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