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A2F200M3F-FGG256 Tech Specifications

Microsemi  A2F200M3F-FGG256 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Number of Pins 256Pins
Supplier Device Package 256-FPBGA (17x17)
Number of I/Os MCU - 25, FPGA - 66I/O
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Published 2011
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 80MHz
Base Part Number A2F200
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 7mA
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 2500Logic Elements/Cells
Core Architecture ARM
Number of Gates 200000Gates
Max Frequency 100MHz
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Registers 4608Registers
Flash Size 256KB
Radiation Hardening No
RoHS Status RoHS Compliant
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A2F200M3F-FGG256 Documents

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