In Stock
:
836 Min. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
A2F060M3E-TQ144I Tech Specifications
Microsemi A2F060M3E-TQ144I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Package / Case | 144-LQFP | |
| Supplier Device Package | 144-TQFP (20x20) | |
| Number of I/Os | MCU - 21, FPGA - 33I/O | |
| Operating Temperature | -40°C~100°C TJ | |
| Packaging | Tray | |
| Series | SmartFusion® | |
| Published | 2015 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Max Operating Temperature | 100°C | |
| Min Operating Temperature | -40°C | |
| Frequency | 80MHz | |
| Base Part Number | A2F060M3E | |
| Interface | EBI/EMI, I2C, SPI, UART, USART | |
| Speed | 80MHz | |
| RAM Size | 16KB | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DMA, POR, WDT | |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART | |
| Architecture | MCU, FPGA | |
| Core Architecture | ARM | |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |
| Flash Size | 128KB | |
| RoHS Status | Non-RoHS Compliant |
A2F060M3E-TQ144I Documents
Download datasheets and manufacturer documentation for A2F060M3E-TQ144I
- DatasheetsSmartFusion cSoC Datasheet
- PCN Design/SpecificationMult Dev Design Advisory 13/Oct/2017 A2FYYY 07/Nov/2016
- PCN Obsolescence/ EOLMult Devices 04/Apr/2017
- PCN Assembly/OriginMult Dev Test Site 28/Feb/2019
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ



