Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply

A2F060M3E-FGG256I Tech Specifications

Microsemi  A2F060M3E-FGG256I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Number of Pins 256Pins
Supplier Device Package 256-FPBGA (17x17)
Number of I/Os MCU - 26, FPGA - 66I/O
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 80MHz
Base Part Number A2F060M3E
Operating Supply Voltage 1.5V
Interface EBI/EMI, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 3mA
Speed 80MHz
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 660Logic Elements/Cells
Core Architecture ARM
Number of Gates 60000Gates
Max Frequency 100MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
RoHS Status RoHS Compliant
View Similar

A2F060M3E-FGG256I Documents

Download datasheets and manufacturer documentation for   A2F060M3E-FGG256I

A2F060M3E-FGG256I brand manufacturers: Microsemi Corporation, Twicea stock, A2F060M3E-FGG256I reference price.Microsemi Corporation. A2F060M3E-FGG256I parameters, A2F060M3E-FGG256I Datasheet PDF and pin diagram description download.You can use the A2F060M3E-FGG256I Embedded - System On Chip (SoC), DSP Datesheet PDF, find A2F060M3E-FGG256I pin diagram and circuit diagram and usage method of function,A2F060M3E-FGG256I electronics tutorials.You can download from the Twicea.