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WF1M32B-100G2UI3A Tech Specifications

Microsemi  WF1M32B-100G2UI3A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
Module Flash Module
Module Density 32Mbit
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 8M
Data Bus Width (bit) 32
Max. Access Time (ns) 100
Chip Configuration 1Mx8
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 120
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
ECC Support No
Supplier Package CQFP
Mounting Surface Mount
Package Height 2.8(Max)
Package Length 22.36
Package Width 22.36
PCB changed 68
Part Status Obsolete
Pin Count 68
Organization 1Mx32
Self Refresh No
RoHS Status RoHS non-compliant
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WF1M32B-100G2UI3A Documents

Download datasheets and manufacturer documentation for   WF1M32B-100G2UI3A

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