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W78M32VP-110BM Tech Specifications

Microsemi  W78M32VP-110BM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
Module Flash Module
Module Density 256Mbit
Number of Chip per Module 2Chip per Modules
Chip Density (bit) 128M
Data Bus Width (bit) 32
Max. Access Time (ns) 110
Chip Configuration 8Mx16
Chip Package Type PBGA
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 110
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Military
ECC Support No
Supplier Package BGA
Mounting Surface Mount
Package Height 2.15(Max)
Package Length 22.1(Max)
Package Width 13.1(Max)
PCB changed 159
Part Status Obsolete
Pin Count 159
Organization 8Mx32
Self Refresh No
RoHS Status Supplier Unconfirmed
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W78M32VP-110BM Documents

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