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W3H128M72E-667SBM Tech Specifications

Microsemi  W3H128M72E-667SBM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package Width 16.1(Max)
PCB changed 208
Package Length 22.1(Max)
Package Height 4.57(Max)
Mounting Surface Mount
Supplier Package BGA
SPD EEPROM Support No
CAS Latency 6
Number of Chip Banks 8Chip Banks
ECC Support Yes
Supplier Temperature Grade Military
Maximum Operating Temperature (°C) 125
Minimum Operating Temperature (°C) -55
Operating Current (mA) 1375
Maximum Operating Supply Voltage (V) 1.9
Typical Operating Supply Voltage (V) 1.8
Minimum Operating Supply Voltage (V) 1.7
Chip Package Type PBGA
Maximum Clock Rate (MHz) 667
Max. Access Time (ns) 1.25
Data Bus Width (bit) 72
Chip Density (bit) 1.8G
Number of Chip per Module 5Chip per Modules
Module Density 1Gbyte
Module DRAM Module
ECCN (US) 4A994.a
Part Status Active
Pin Count 208
Organization 128Mx72
PLL No
Self Refresh Yes
RoHS Status Supplier Unconfirmed
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W3H128M72E-667SBM Documents

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