CD3037B Tech Specifications

Microsemi  CD3037B technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 4-SMD, No Lead
Surface Mount YES
Diode Element Material SILICON
Number of Terminals 1Terminal
Package Bulk
Mfr Suntsu Electronics, Inc.
Product Status Active
Package Description DIE-1
Package Style UNCASED CHIP
Package Body Material UNSPECIFIED
Reflow Temperature-Max (s) NOT SPECIFIED
Reference Voltage-Nom 51 V
Operating Temperature-Max 200 °C
Rohs Code No
Manufacturer Part Number CD3037B
Power Dissipation (Max) 1 W
Package Shape SQUARE
Manufacturer Microsemi Corporation
Number of Elements 1 Element
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Risk Rank 5.61
Part Package Code DIE
Operating Temperature -20°C ~ 70°C
Series SXT114
Size / Dimension 0.063 L x 0.047 W (1.60mm x 1.20mm)
JESD-609 Code e0
Pbfree Code No
ECCN Code EAR99
Type MHz Crystal
Terminal Finish TIN LEAD
HTS Code 8541.10.00.50
Subcategory Voltage Reference Diodes
Technology ZENER
Terminal Position UPPER
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Frequency 30 MHz
Frequency Stability ±25ppm
Pin Count 1
JESD-30 Code S-XUUC-N1
Qualification Status Not Qualified
ESR (Equivalent Series Resistance) 100 Ohms
Polarity UNIDIRECTIONAL
Configuration SINGLE
Load Capacitance 8pF
Diode Type ZENER DIODE
Operating Mode Fundamental
Frequency Tolerance ±15ppm
Voltage Tol-Max 20%
Working Test Current 5 mA
Dynamic Impedance-Max 95 Ω
Height Seated (Max) 0.018 (0.45mm)
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