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PC28F00AP30BFA Tech Specifications

Micron Technology  PC28F00AP30BFA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 64-TBGA
Surface Mount YES
Number of Pins 64Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Series Axcell™
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
ECCN Code 3A991.B.1.A
Terminal Finish TIN SILVER COPPER
Additional Feature BOTTOM BOOT
HTS Code 8542.32.00.51
Voltage - Supply 1.7V~2V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number 28F00AP30
Pin Count 64
Operating Supply Voltage 1.8V
Power Supplies 1.81.8/3.3V
Voltage 1.7V
Interface Parallel, Serial
Memory Size 1Gb 64M x 16
Nominal Supply Current 31mA
Clock Frequency 52MHz
Memory Format FLASH
Memory Interface Parallel
Memory Width 16
Write Cycle Time - Word, Page 100ns
Address Bus Width 26b
Density 1 Gb
Standby Current-Max 0.00024A
Access Time (Max) 100 ns
Sync/Async Asynchronous
Word Size 16b
Data Polling NO
Toggle Bit NO
Number of Sectors/Size 41023Sectors/Sizes
Page Size 16words
Boot Block BOTTOM
Length 10mm
Height Seated (Max) 1.2mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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