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NAND08GW3C2BN6E Tech Specifications

Micron Technology  NAND08GW3C2BN6E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Number of Pins 48Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2009
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Terminal Pitch 0.5mm
Base Part Number NAND08G
Power Supplies 3/3.3V
Memory Size 8Gb 1G x 8
Nominal Supply Current 30mA
Memory Format FLASH
Memory Interface Parallel
Organization 1GX8
Memory Width 8
Write Cycle Time - Word, Page 25ns
Address Bus Width 30b
Density 8 Gb
Standby Current-Max 0.00005A
Access Time (Max) 20 ns
Sync/Async Asynchronous
Word Size 8b
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 4K
Sector Size 256K
Page Size 2kB
Ready/Busy YES
Radiation Hardening No
RoHS Status ROHS3 Compliant
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