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NAND02GR3B2DN6E Tech Specifications

Micron Technology  NAND02GR3B2DN6E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Number of Pins 48Pins
Supplier Device Package 48-TSOP
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Voltage - Supply 1.7V~1.95V
Base Part Number NAND02G
Operating Supply Voltage 1.8V
Interface Parallel
Max Supply Voltage 1.95V
Min Supply Voltage 1.7V
Memory Size 2Gb 256M x 8
Nominal Supply Current 20mA
Access Time 45ns
Memory Format FLASH
Memory Interface Parallel
Write Cycle Time - Word, Page 45ns
Address Bus Width 8b
Density 2 Gb
Sync/Async Asynchronous
Word Size 8b
RoHS Status ROHS3 Compliant
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