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M29DW323DB70ZE6E Tech Specifications

Micron Technology  M29DW323DB70ZE6E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 48-TFBGA
Surface Mount YES
Number of Pins 48Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2004
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
Termination SMD/SMT
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature BOTTOM BOOT BLOCK
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number M29DW323
Pin Count 48
Power Supplies 3/3.3V
Voltage 2.7V
Memory Size 32Mb 4M x 8 2M x 16
Nominal Supply Current 10mA
Memory Format FLASH
Memory Interface Parallel
Organization 2MX16
Memory Width 16
Write Cycle Time - Word, Page 70ns
Density 32 Mb
Standby Current-Max 0.0001A
Access Time (Max) 70 ns
Sync/Async Asynchronous
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 863Sectors/Sizes
Sector Size 8K64K
Ready/Busy YES
Boot Block BOTTOM
Common Flash Interface YES
Length 8mm
Height Seated (Max) 1.2mm
Width 6mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
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