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JS28F00AP30BFA Tech Specifications

Micron Technology  JS28F00AP30BFA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold, Tin
Mounting Type Surface Mount
Package / Case 56-TFSOP (0.724, 18.40mm Width)
Surface Mount YES
Number of Pins 56Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Series Axcell™
Published 2004
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56Terminations
Terminal Finish Matte Tin (Sn)
Additional Feature BOTTOM BOOT
Voltage - Supply 1.7V~2V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number 28F00AP30
Operating Supply Voltage 1.8V
Power Supplies 1.81.8/3.3V
Voltage 1.7V
Interface Parallel, Serial
Memory Size 1Gb 64M x 16
Nominal Supply Current 31mA
Clock Frequency 40MHz
Memory Format FLASH
Memory Interface Parallel
Organization 64MX16
Memory Width 16
Write Cycle Time - Word, Page 110ns
Address Bus Width 26b
Density 1 Gb
Standby Current-Max 0.00024A
Access Time (Max) 110 ns
Sync/Async Asynchronous
Word Size 16b
Data Polling NO
Toggle Bit NO
Number of Sectors/Size 41023Sectors/Sizes
Sector Size 16K64K
Page Size 16words
Boot Block BOTTOM
Length 18.4mm
Height Seated (Max) 1.2mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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