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MT9HTF3272AY-53EB3 Tech Specifications

Micron Technology  MT9HTF3272AY-53EB3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
Module DRAM Module
Module Density 256Mbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 256M
Data Bus Width (bit) 72
Max. Access Time (ns) 0.05
Maximum Clock Rate (MHz) 533
Chip Configuration 32Mx8
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 1440
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
ECC Support Yes
Number of Ranks SingleRank
CAS Latency 4
Standard Package Name DIM
Supplier Package UDIMM
Mounting Socket
Package Height 30.5(Max)
Package Length 133.5(Max)
Package Width 2.7(Max)
PCB changed 240
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 240
Organization 32Mx72
Module Type 240UDIMM
RoHS Status Yes with exemptions
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MT9HTF3272AY-53EB3 Documents

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