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MT8VDDT3264AY-40BGB Tech Specifications

Micron Technology  MT8VDDT3264AY-40BGB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 256Mbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 256M
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 400
Chip Configuration 32Mx8
Minimum Operating Supply Voltage (V) 2.5
Typical Operating Supply Voltage (V) 2.6
Maximum Operating Supply Voltage (V) 2.7
Operating Current (mA) 1600
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
ECC Support No
Number of Ranks SingleRank
CAS Latency 3
Standard Package Name DIM
Supplier Package UDIMM
Mounting Socket
Package Height 28.7(Max)
Package Length 133.5(Max)
Package Width 3.18(Max)
PCB changed 184
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 184
Organization 32Mx64
Module Type 184UDIMM
RoHS Status Yes with exemptions
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