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MT8LSDT3264AG-13ED2 Tech Specifications

Micron Technology  MT8LSDT3264AG-13ED2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8542.32.00.28
Module DRAM Module
Module Density 256Mbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 256M
Data Bus Width (bit) 64
Max. Access Time (ns) 5.4
Maximum Clock Rate (MHz) 133
Chip Configuration 32Mx8
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 1080
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Module Sides Single
ECC Support No
Number of Ranks SingleRank
Number of Chip Banks 4Chip Banks
CAS Latency 2
PC Type PC-133
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package UDIMM
Mounting Socket
Package Height 28.73(Max)
Package Length 133.5(Max)
Package Width 3.99(Max)
PCB changed 168
Lead Shape No Lead
Part Status Obsolete
Pin Count 168
Organization 32Mx64
PLL No
Refresh Cycles 8K
Self Refresh Yes
Module Type 168UDIMM
RoHS Status RoHS non-compliant
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MT8LSDT3264AG-13ED2 Documents

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