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MT8HTF6464HDY-800F1 Tech Specifications

Micron Technology  MT8HTF6464HDY-800F1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 512Mbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 512M
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 800
Chip Configuration 32Mx16
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 1200
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support No
Number of Ranks DualRank
Number of Chip Banks 4Chip Banks
CAS Latency 6
PC Type PC2-6400
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package SODIMM
Mounting Socket
Package Height 31.15(Max)
Package Length 67.75(Max)
Package Width 3.8(Max)
PCB changed 200
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 200
Organization 64Mx64
PLL No
Refresh Cycles 8K
Self Refresh Yes
Module Type 200SODIMM
RoHS Status RoHS Compliant
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