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MT8HTF12864HTY-667E1 Tech Specifications

Micron Technology  MT8HTF12864HTY-667E1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
HTS 8542.32.00.32
Module DRAM Module
Module Density 1Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 1G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 667
Chip Configuration 64Mx16
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 900
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Module Sides Double
ECC Support No
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 5
PC Type PC2-5300
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package SODIMM
Mounting Socket
Package Height 31.15(Max)
Package Length 67.75(Max)
Package Width 3.8(Max)
PCB changed 200
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 200
Organization 128Mx64
PLL No
Refresh Cycles 8K
Self Refresh Yes
Module Type 200SODIMM
RoHS Status RoHS Compliant
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