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MT4LSDT1664AG-13EG1 Tech Specifications

Micron Technology  MT4LSDT1664AG-13EG1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 128Mbyte
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 256M
Data Bus Width (bit) 64
Max. Access Time (ns) 5.4
Maximum Clock Rate (MHz) 133
Chip Configuration 16Mx16
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 540
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 65
Supplier Temperature Grade Commercial
Module Sides Single
ECC Support No
Number of Ranks SingleRank
Number of Chip Banks 4Chip Banks
CAS Latency 2
PC Type PC-133
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 25.53(Max)
Package Length 133.5(Max)
Package Width 3.18(Max)
PCB changed 168
Lead Shape No Lead
Packaging Tray
Part Status Unconfirmed
Pin Count 168
Organization 16Mx64
PLL No
Refresh Cycles 8K
Self Refresh Yes
Module Type 168UDIMM
RoHS Status RoHS non-compliant
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MT4LSDT1664AG-13EG1 Documents

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