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- MT4HTF3264HY-667F1
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MT4HTF3264HY-667F1 Tech Specifications
Micron Technology MT4HTF3264HY-667F1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mount | Socket | |
| Surface Mount | NO | |
| Number of Pins | 200Pins | |
| Number of Terminals | 200Terminals | |
| ECCN (US) | EAR99 | |
| HTS | 8542.32.00.32 | |
| Module | DRAM Module | |
| Module Density | 256Mbyte | |
| Number of Chip per Module | 4Chip per Modules | |
| Chip Density (bit) | 512M | |
| Data Bus Width (bit) | 64 | |
| Maximum Clock Rate (MHz) | 667 | |
| Chip Configuration | 32Mx16 | |
| Minimum Operating Supply Voltage (V) | 1.7 | |
| Typical Operating Supply Voltage (V) | 1.8 | |
| Maximum Operating Supply Voltage (V) | 1.9 | |
| Operating Current (mA) | 1000 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 70 | |
| Supplier Temperature Grade | Commercial | |
| Module Sides | Single | |
| ECC Support | No | |
| Number of Ranks | SingleRank | |
| Number of Chip Banks | 4Chip Banks | |
| CAS Latency | 5 | |
| PC Type | PC2-5300 | |
| SPD EEPROM Support | Yes | |
| Standard Package Name | DIM | |
| Supplier Package | SODIMM | |
| Mounting | Socket | |
| Package Height | 30(Max) | |
| Package Length | 67.75(Max) | |
| Package Width | 2.45(Max) | |
| PCB changed | 200 | |
| Lead Shape | No Lead | |
| Number of Elements | 4 Elements | |
| RoHS | Compliant | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Number of Words Code | 32000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | DIMM200,24 | |
| Access Time-Max | 0.45 ns | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | MT4HTF3264HY-667F1 | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| Number of Words | 33554432 wordsWord | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Package Code | DIMM | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Micron Technology Inc | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Risk Rank | 5.84 | |
| Packaging | Tray | |
| Part Status | Obsolete | |
| Max Operating Temperature | 70 °C | |
| Min Operating Temperature | 0 °C | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.6 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 200 | |
| JESD-30 Code | R-PDMA-N200 | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 1.8 V | |
| Power Supplies | 1.8 V | |
| Temperature Grade | COMMERCIAL | |
| Max Supply Voltage | 1.9 V | |
| Min Supply Voltage | 1.7 V | |
| Supply Current-Max | 1.4 mA | |
| Data Bus Width | 64 b | |
| Organization | 32Mx64 | |
| Output Characteristics | 3-STATE | |
| Memory Width | 64 | |
| Standby Current-Max | 0.028 A | |
| Memory Density | 2147483648 bit | |
| Max Frequency | 667 MHz | |
| PLL | No | |
| I/O Type | COMMON | |
| Memory IC Type | DDR DRAM MODULE | |
| Refresh Cycles | 8K | |
| Self Refresh | Yes | |
| Module Type | 200SODIMM | |
| RoHS Status | RoHS Compliant | |
| Radiation Hardening | No |
MT4HTF3264HY-667F1 Documents
Download datasheets and manufacturer documentation for MT4HTF3264HY-667F1
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