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MT36HTS1G72PY-667A1 Tech Specifications

Micron Technology  MT36HTS1G72PY-667A1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 4G(TwinDie)
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 667
Chip Configuration 1Gx4
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 3294
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 5
PC Type PC2-5300
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package RDIMM
Mounting Socket
Package Height 30.15(Max)
Package Length 133.5(Max)
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 240
Organization 1Gx72
PLL Yes
Refresh Cycles 8K
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant
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