MT18HTS51272RHY-667A1 Tech Specifications

Micron Technology  MT18HTS51272RHY-667A1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Socket
Number of Pins 200Pins
ECCN (US) EAR99
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G(TwinDie)
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 667
Chip Configuration 512Mx8
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 1647
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 5
PC Type PC2-5300
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package SORDIMM
Mounting Socket
Package Height 30.15(Max)
Package Length 67.75(Max)
Package Width 3.8(Max)
PCB changed 200
Lead Shape No Lead
Number of Elements 18 Elements
RoHS Compliant
Packaging Tray
Part Status Obsolete
Max Operating Temperature 70 °C
Min Operating Temperature 0 °C
Pin Count 200
Operating Supply Voltage 1.8 V
Max Supply Voltage 1.9 V
Min Supply Voltage 1.7 V
Organization 512Mx72
Max Frequency 667 MHz
PLL Yes
Refresh Cycles 8K
Self Refresh Yes
Module Type 200SORDIMM
RoHS Status Yes with exemptions
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