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MT18HTS25672RHY-667G1 Tech Specifications

Micron Technology  MT18HTS25672RHY-667G1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 2G(TwinDie)
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 667
Chip Configuration 256Mx8
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 1323
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 5
PC Type PC2-5300
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package SORDIMM
Mounting Socket
Package Height 30.15(Max)
Package Length 67.75(Max)
Package Width 3.8(Max)
PCB changed 200
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 200
Organization 256Mx72
PLL Yes
Refresh Cycles 8K
Self Refresh Yes
Module Type 200SORDIMM
RoHS Status Yes with exemptions
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