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MT18HTF25672FDY-667E1D4 Tech Specifications

Micron Technology  MT18HTF25672FDY-667E1D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 1G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 667
Chip Configuration 128Mx8
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 5
PC Type PC2-5300
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package FBDIMM
Mounting Socket
Package Height 30.5(Max)
Package Length 133.5(Max)
Package Width 7.68(Max)
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 256Mx72
PLL No
Refresh Cycles 8K
Self Refresh No
Module Type 240FBDIMM
RoHS Status Yes with exemptions
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