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MT16LSDT3264AY-13EG3 Tech Specifications

Micron Technology  MT16LSDT3264AY-13EG3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Socket
Number of Pins 168Pins
ECCN (US) EAR99
Module DRAM Module
Module Density 256Mbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 128M
Data Bus Width (bit) 64
Max. Access Time (ns) 5.4
Maximum Clock Rate (MHz) 133
Chip Configuration 16Mx8
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 1336
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 65
Supplier Temperature Grade Commercial
ECC Support No
Number of Ranks DualRank
CAS Latency 2
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 35.05(Max)
Package Length 133.5(Max)
Package Width 3.99(Max)
PCB changed 168
Lead Shape No Lead
Number of Elements 16 Elements
RoHS Compliant
Packaging Tray
Part Status Obsolete
Max Operating Temperature 65 °C
Min Operating Temperature 0 °C
Pin Count 168
Operating Supply Voltage 3.3 V
Max Supply Voltage 3.6 V
Min Supply Voltage 3 V
Access Time 5.4 ns
Data Bus Width 64 b
Organization 32Mx64
Max Frequency 133 MHz
Module Type 168UDIMM
RoHS Status Yes with exemptions
Radiation Hardening No
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