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MT16LSDT1664AG-13EG8 Tech Specifications

Micron Technology  MT16LSDT1664AG-13EG8 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8542.32.00.02
Module DRAM Module
Module Density 128Mbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 64M
Data Bus Width (bit) 64
Max. Access Time (ns) 5.4
Maximum Clock Rate (MHz) 133
Chip Configuration 8Mx8
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 1216
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 65
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support No
Number of Ranks DualRank
Number of Chip Banks 4Chip Banks
CAS Latency 2
PC Type PC-133
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package UDIMM
Mounting Socket
Package Height 35.05(Max)
Package Length 133.5(Max)
Package Width 3.99(Max)
PCB changed 168
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 168
Organization 16Mx64
PLL No
Refresh Cycles 4K
Self Refresh Yes
Module Type 168UDIMM
RoHS Status RoHS non-compliant
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MT16LSDT1664AG-13EG8 Documents

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