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ZL30364GDG2 Tech Specifications
Microchip ZL30364GDG2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) | |
| Factory Lead Time | 8 Weeks | |
| Mounting Type | Surface Mount | |
| Surface Mount | YES | |
| Number of Pins | 144Pins | |
| Supplier Device Package | 144-LBGA | |
| Frequency(Max) | 750MHz | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tray | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 144Terminations | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Output | LVCMOS, LVPECL | |
| Number of Circuits | 1Circuit | |
| Input | Clock | |
| Ratio - Input:Output | 11:16 | |
| PLL | Yes | |
| Differential - Input:Output | Yes/Yes | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Main Purpose | Ethernet, Fibre Channel, SONET/SDH, Stratum | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
ZL30364GDG2 Documents
Download datasheets and manufacturer documentation for ZL30364GDG2
- PCN OtherMultiple Changes 05/Apr/2019
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN Part NumberPart Number Change 05/Apr/2019
- PCN Assembly/OriginBond Wire 08/Nov/2019
- DatasheetsZL30364 Short Form Datasheet
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