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ZL30143GGG2 Tech Specifications
Microchip ZL30143GGG2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Factory Lead Time | 7 Weeks | |
Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) | |
Package / Case | 100-FBGA | |
Mounting Type | Surface Mount | |
Mount | Surface Mount | |
Number of Pins | 100Pins | |
Frequency(Max) | 622.08MHz | |
Published | 2001 | |
Packaging | Tray | |
Operating Temperature | -40°C~85°C | |
JESD-609 Code | e1 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 100Terminations | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Number of Functions | 1Function | |
Terminal Pitch | 0.8mm | |
Base Part Number | ZL30143 | |
Number of Circuits | 1Circuit | |
Input | Clock | |
Ratio - Input:Output | 13:14 | |
PLL | Yes | |
Differential - Input:Output | No/Yes | |
Telecom IC Type | ATM/SONET/SDH SUPPORT CIRCUIT | |
Main Purpose | Ethernet, SONET/SDH, Stratum | |
Width | 9mm | |
Length | 9mm | |
RoHS Status | ROHS3 Compliant |
ZL30143GGG2 Documents
Download datasheets and manufacturer documentation for ZL30143GGG2
- DatasheetsZL30143
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN Assembly/OriginBond Wire 08/Nov/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN OtherMultiple Changes 05/Apr/2019
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