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ZL30131GGG2 Tech Specifications
Microchip ZL30131GGG2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Factory Lead Time | 7 Weeks | |
Mounting Type | Surface Mount | |
Package / Case | 100-FBGA | |
Surface Mount | YES | |
Number of Pins | 100Pins | |
Frequency(Max) | 622.08MHz | |
Operating Temperature | -40°C~85°C | |
Packaging | Tray | |
JESD-609 Code | e1 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 100Terminations | |
Terminal Finish | TIN SILVER COPPER | |
Voltage - Supply | 2.97V~3.63V | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Number of Functions | 1Function | |
Supply Voltage | 1.8V | |
Terminal Pitch | 0.8mm | |
Base Part Number | ZL30131 | |
Output | LVCMOS, LVPECL | |
Pin Count | 100 | |
Number of Circuits | 1Circuit | |
Input | LVCMOS | |
Ratio - Input:Output | 11:11 | |
PLL | Yes | |
Differential - Input:Output | No/Yes | |
Telecom IC Type | ATM/SONET/SDH SUPPORT CIRCUIT | |
Main Purpose | Ethernet, SONET/SDH | |
Length | 9mm | |
Width | 9mm | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant |
ZL30131GGG2 Documents
Download datasheets and manufacturer documentation for ZL30131GGG2
- DatasheetsZL30131
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN Assembly/OriginBond Wire 08/Nov/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN OtherMult Devices 06/May/2019
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