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UTC2000-E/MG Tech Specifications
Microchip UTC2000-E/MG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 16-VFQFN Exposed Pad | |
| Number of Pins | 16Pins | |
| Usage Level | Automotive grade | |
| Operating Temperature | -40°C~125°C | |
| Packaging | Tube | |
| Published | 2016 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 16Terminations | |
| Applications | USB, Type-C Controller | |
| Voltage - Supply | 4.5V~5.5V | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Supply Voltage | 5V | |
| Terminal Pitch | 0.5mm | |
| Base Part Number | UTC2000 | |
| Output Voltage | 5V | |
| Number of Channels | 1Channel | |
| Operating Supply Current | 185μA | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS | |
| Length | 3mm | |
| Height Seated (Max) | 0.9mm | |
| Width | 3mm | |
| RoHS Status | ROHS3 Compliant |
UTC2000-E/MG Documents
Download datasheets and manufacturer documentation for UTC2000-E/MG
- PCN Design/SpecificationCuPdAu bond wire 14/Dec/2016 BondWire Qual 27/Dec/2016
- PCN Assembly/OriginMult Devices 14/Aug/2017
- PCN PackagingPacking Changes 10/Oct/2016
- ConflictMineralStatementMicrochip-company-68.pdf
- DatasheetsUTC2000 Datasheet UTC2000-E-MG-Microchip-datasheet-48271177.pdf
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