UM4306SM Tech Specifications

Microchip  UM4306SM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Package / Case SQ-MELF
Surface Mount YES
Number of Pins 2Pins
Supplier Device Package -
Diode Element Material SILICON
Number of Terminals 2Terminals
RoHS N
Maximum Diode Capacitance 2.2 pF
Maximum Series Resistance @ Maximum IF 1.5 Ohms
If - Forward Current 100 mA
Maximum Operating Frequency 1 GHz
Mounting Styles SMD/SMT
Carrier Life 6 us
Ir - Reverse Current 10 uA
Pd - Power Dissipation 15 W
Factory Pack QuantityFactory Pack Quantity 1
Vr - Reverse Voltage 600 V
Package Tape & Reel (TR)
Mfr Microchip Technology
Power Dissipation (Max) 15 W
Product Status Active
Package Description O-XELF-R2
Package Style LONG FORM
Package Body Material UNSPECIFIED
Reflow Temperature-Max (s) NOT SPECIFIED
Rohs Code Yes
Manufacturer Part Number UM4306SM
Package Shape ROUND
Number of Elements 1 Element
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Risk Rank 5.62
Operating Temperature -
Series -
Pbfree Code No
ECCN Code EAR99
Type Switching Pin Diodes
Applications ATTENUATOR
Additional Feature LOW DISTORTION
HTS Code 8541.10.00.80
Terminal Position END
Terminal Form WRAP AROUND
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code compliant
JESD-30 Code O-XELF-R2
Qualification Status Not Qualified
Configuration Single
Element Configuration Single
Diode Type PIN - Single
Power Dissipation 15 W
Case Connection ISOLATED
Capacitance @ Vr, F 2.2pF @ 100V, 1MHz
Reverse Voltage 600 V
Voltage - Peak Reverse (Max) 600V
Breakdown Voltage-Min 600 V
Reverse Test Voltage 100 V
Frequency Band HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
Diode Capacitance-Nom 2.2 pF
Resistance @ If, F 1.5Ohm @ 100mA, 100MHz
Diode Capacitance-Max 2.2 pF
Minority Carrier Lifetime-Nom 6 µs
Diode Res Test Current 100 mA
Diode Res Test Frequency 100 MHz
Diode Forward Resistance-Max 1.5 Ω
Radiation Hardening No
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