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TCN75AVUA713 Tech Specifications
Microchip TCN75AVUA713 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | |
| Number of Pins | 8Pins | |
| Test Conditions | -40°C ~ 125°C | |
| Usage Level | Military grade | |
| Operating Temperature | -40°C~125°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2007 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 8Terminations | |
| Temperature Coefficient | POSITIVE ppm/°C | |
| Terminal Finish | Matte Tin (Sn) | |
| Voltage - Supply | 2.7V~5.5V | |
| Base Part Number | TCN75A | |
| Body Length or Diameter | 3mm | |
| Body Breadth | 3 mm | |
| Output Type | I2C | |
| Power Supplies | 3/5V | |
| Interface | 2-Wire, I2C, SMBus, Serial | |
| Termination Type | SOLDER | |
| Operating Supply Current | 200μA | |
| Number of Bits | 12Bits | |
| Resolution | 11 b | |
| Sensor Type | Digital, Local | |
| Sensors/Transducers Type | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL | |
| Max Supply Voltage (DC) | 5.5V | |
| Min Supply Voltage (DC) | 2.7V | |
| Housing | PLASTIC | |
| Accuracy - Highest (Lowest) | ±2°C | |
| Sensing Temperature - Local | -40°C~125°C | |
| Accuracy-Max | 2 Cel | |
| Features | Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode | |
| Body Height | 1.1mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
TCN75AVUA713 Documents
Download datasheets and manufacturer documentation for TCN75AVUA713
- DatasheetsTCN75A Analog and Interface Product Guide TCN75A Revision A Errata TCN75AVUA713-Microchip-datasheet-10341012.pdf TCN75AVUA713-Microchip-datasheet-52752.pdf TCN75AVUA713-Microchip-datasheet-21432.pdf TCN75AVUA713-Microchip-datasheet-2841.pdf
- PCN Design/SpecificationBond Wire Qualification 08/Jun/2016
- PCN Assembly/OriginMult Devices 26/Jun/2018
- PCN PackagingPacking Changes 10/Oct/2016
- ConflictMineralStatementMicrochip-company-68.pdf
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