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- SST12LF03-Q3DE
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SST12LF03-Q3DE Tech Specifications
Microchip SST12LF03-Q3DE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 14 Weeks | |
| Package / Case | 20-UFQFN Exposed Pad | |
| Surface Mount | YES | |
| Number of Pins | 20Pins | |
| Packaging | Tape & Reel (TR) | |
| Published | 2011 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 20Terminations | |
| Terminal Finish | Matte Tin (Sn) - annealed | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -25°C | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.4mm | |
| Frequency | 2.4GHz | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Temperature Grade | OTHER | |
| Max Supply Voltage | 3.6V | |
| Min Supply Voltage | 3V | |
| Nominal Supply Current | 340mA | |
| Telecom IC Type | TELECOM CIRCUIT | |
| RF Type | Bluetooth, Zigbee® | |
| Height | 550μm | |
| Length | 3mm | |
| Width | 3mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
SST12LF03-Q3DE Documents
Download datasheets and manufacturer documentation for SST12LF03-Q3DE
- DatasheetsSST12LF03 SST12LF03 Brief
- PCN PackagingMBB/Label Chgs 16/Nov/2018
- ConflictMineralStatementMicrochip-company-68.pdf
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