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MT89L85AP1 Tech Specifications
Microchip MT89L85AP1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 7 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 44-LCC (J-Lead) | |
| Number of Pins | 44Pins | |
| Weight | 2.386605g | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tube | |
| Published | 2006 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 44Terminations | |
| Terminal Finish | MATTE TIN | |
| Max Power Dissipation | 1W | |
| Voltage - Supply | 3V~3.6V | |
| Terminal Position | QUAD | |
| Terminal Form | J BEND | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 3.3V | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Function | Switch | |
| Operating Supply Voltage | 3.3V | |
| Number of Circuits | 1Circuit | |
| Operating Supply Current | 4mA | |
| Number of Ports | 8Ports | |
| Max Supply Current | 4mA | |
| Height Seated (Max) | 4.57mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
MT89L85AP1 Documents
Download datasheets and manufacturer documentation for MT89L85AP1
- DatasheetsMT89L85
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN OtherMult Devices 06/May/2019
- PCN Assembly/OriginMT89L8YYY 26/Feb/2020
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