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MT8889CE1 Tech Specifications
Microchip MT8889CE1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 7 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | 20-DIP (0.300, 7.62mm) | |
| Number of Pins | 20Pins | |
| Weight | 2.259996g | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tube | |
| Published | 2001 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 20Terminations | |
| Terminal Finish | MATTE TIN | |
| Max Power Dissipation | 1W | |
| Voltage - Supply | 4.75V~5.25V | |
| Terminal Position | DUAL | |
| Supply Voltage | 5V | |
| Terminal Pitch | 2.54mm | |
| Frequency | 3.58MHz | |
| Function | DTMF Transceiver | |
| Operating Supply Voltage | 5V | |
| Power Supplies | 5V | |
| Number of Circuits | 1Circuit | |
| Operating Supply Current | 7mA | |
| Logic Function | Transceiver | |
| Telecom IC Type | DTMF SIGNALING CIRCUIT | |
| Length | 25.905mm | |
| Height Seated (Max) | 5.33mm | |
| Width | 7.62mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
MT8889CE1 Documents
Download datasheets and manufacturer documentation for MT8889CE1
- DatasheetsMT8889C
- PCN Obsolescence/ EOLMult Devices 21/Aug/2017
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