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MT8870DS1 Tech Specifications
Microchip MT8870DS1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) | |
| Package / Case | 18-SOIC (0.295, 7.50mm Width) | |
| Mounting Type | Surface Mount | |
| Mount | Surface Mount | |
| Number of Pins | 18Pins | |
| Packaging | Tube | |
| Operating Temperature | -40°C~85°C | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 18Terminations | |
| Terminal Finish | MATTE TIN | |
| Max Power Dissipation | 500mW | |
| Voltage - Supply | 4.75V~5.25V | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 5V | |
| Frequency | 3.58MHz | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Function | DTMF Receiver | |
| Operating Supply Voltage | 5V | |
| Power Supplies | 5V | |
| Number of Circuits | 1Circuit | |
| Operating Supply Current | 3mA | |
| Nominal Supply Current | 3mA | |
| Logic Function | Receiver | |
| Telecom IC Type | DTMF SIGNALING CIRCUIT | |
| Width | 7.5mm | |
| Height Seated (Max) | 2.65mm | |
| RoHS Status | ROHS3 Compliant | |
| Radiation Hardening | No |
MT8870DS1 Documents
Download datasheets and manufacturer documentation for MT8870DS1
- PCN OtherMultiple Changes 05/Apr/2019
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- DatasheetsMT8870D(-1)
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