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MEC1609-PZP Tech Specifications

Microchip  MEC1609-PZP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 144-LFBGA
Surface Mount YES
Number of I/Os 115I/Os
Usage Level Automotive grade
Operating Temperature 0°C~70°C
Packaging Tray
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 144Terminations
Applications I/O Controller
Voltage - Supply 3.3V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Base Part Number MEC1609
JESD-30 Code S-PBGA-B144
Interface ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC
RAM Size 16KB
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Core Processor ARC-625D
Program Memory Type FLASH (192kB)
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
Screening Level TS 16949
External Data Bus Width 32
Number of Serial I/Os 8Serial I/Os
Bus Compatibility I2C; LPC; PCI; SPI
Data Transfer Rate-Max 0.25 MBps
Number of DMA Channels 8DMA Channels
Communication Protocol ASYNC, BIT, BYTE, UART
Length 7mm
Height Seated (Max) 1.2mm
Width 7mm
RoHS Status ROHS3 Compliant
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MEC1609-PZP Documents

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