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- MCP6002-I/SN
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MCP6002-I/SN Tech Specifications
Microchip MCP6002-I/SN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Factory Lead Time | 8 Weeks | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
Number of Pins | 8Pins | |
Operating Temperature | -40°C~85°C | |
Packaging | Tube | |
Published | 2003 | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 8Terminations | |
ECCN Code | EAR99 | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Position | DUAL | |
Terminal Form | GULL WING | |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 2Functions | |
Supply Voltage | 5V | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Base Part Number | MCP6002 | |
Pin Count | 8 | |
Output Type | Rail-to-Rail | |
Operating Supply Voltage | 5.5V | |
Number of Channels | 2Channels | |
Number of Circuits | 2Circuits | |
Nominal Supply Current | 100μA | |
Output Current | 23mA | |
Slew Rate | 0.6V/μs | |
Architecture | VOLTAGE-FEEDBACK | |
Amplifier Type | General Purpose | |
Common Mode Rejection Ratio | 60 dB | |
Current - Input Bias | 1pA | |
Voltage - Supply, Single/Dual (±) | 1.8V~6V | |
Input Offset Voltage (Vos) | 4.5mV | |
Unity Gain BW-Nom | 1000 kHz | |
Voltage Gain | 112dB | |
Power Supply Rejection Ratio (PSRR) | 86dB | |
Low-Offset | NO | |
Frequency Compensation | YES | |
Supply Voltage Limit-Max | 7V | |
Low-Bias | YES | |
Micropower | YES | |
Programmable Power | NO | |
Max Junction Temperature (Tj) | 150°C | |
Height | 1.75mm | |
Length | 4.9mm | |
Width | 3.9mm | |
REACH SVHC | No SVHC | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
MCP6002-I/SN Documents
Download datasheets and manufacturer documentation for MCP6002-I/SN
- DatasheetsMCP6001/1R/1U/2/4
- PCN Design/SpecificationMCP6001/R/U/2/4 28/Nov/2019 MCP6001/R/U/2/4 06/Mar/2020
- PCN Assembly/OriginBond Wire 20/Mar/2017
- PCN PackagingPacking Changes 10/Oct/2016
- ConflictMineralStatementMicrochip-company-68.pdf
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