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MCP23S09-E/P Tech Specifications

Microchip  MCP23S09-E/P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 6 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 18-DIP (0.300, 7.62mm)
Number of Pins 18Pins
Weight 1.270087g
Number of I/Os 8I/Os
Operating Temperature -40°C~125°C
Packaging Tube
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 18Terminations
Termination DIP
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - annealed
Max Power Dissipation 700mW
Voltage - Supply 1.8V~5.5V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 5V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number MCP23S09
Pin Count 18
Qualification Status Not Qualified
Output Type Open Drain
Power Supplies 2/5V
Number of Channels 1Channel
Interface SPI
Number of Ports 1Port
Nominal Supply Current 1mA
Output Current 25mA
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE
Number of Bits 8Bits
Clock Frequency 10MHz
Interrupt Output Yes
Height Seated (Max) 5.334mm
Width 7.62mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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MCP23S09-E/P Documents

Download datasheets and manufacturer documentation for   MCP23S09-E/P

MCP23S09-E/P brand manufacturers: Microchip Technology, Twicea stock, MCP23S09-E/P reference price.Microchip Technology. MCP23S09-E/P parameters, MCP23S09-E/P Datasheet PDF and pin diagram description download.You can use the MCP23S09-E/P Interface - I/O Expanders, DSP Datesheet PDF, find MCP23S09-E/P pin diagram and circuit diagram and usage method of function,MCP23S09-E/P electronics tutorials.You can download from the Twicea.