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LE89156PQC Tech Specifications
Microchip LE89156PQC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) | |
| Package / Case | 48-VQFN Exposed Pad | |
| Mounting Type | Surface Mount | |
| Mount | Surface Mount | |
| Number of Pins | 48Pins | |
| Supplier Device Package | 48-QFN (7x7) | |
| Weight | 150.507618mg | |
| Usage Level | Industrial grade | |
| Packaging | Tray | |
| Operating Temperature | -40°C~85°C | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Max Power Dissipation | 1.7W | |
| Voltage - Supply | 3.135V~3.465V | |
| Function | Telecom Circuit | |
| Number of Channels | 1Channel | |
| Interface | PCM | |
| Number of Circuits | 1Circuit | |
| Max Supply Voltage | 15V | |
| Min Supply Voltage | 4.4V | |
| RoHS Status | ROHS3 Compliant | |
| Radiation Hardening | No |
LE89156PQC Documents
Download datasheets and manufacturer documentation for LE89156PQC
- PCN OtherMultiple Changes 05/Apr/2019
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN Part NumberPart Number Change 05/Apr/2019
- PCN Assembly/OriginBond Wire 08/Nov/2019
- DatasheetsLe89156 Brief
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