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HV583GA-G Tech Specifications
Microchip HV583GA-G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 7 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 169-TFBGA | |
| Number of Elements | 4 Elements | |
| Operating Temperature | -25°C~125°C | |
| Packaging | Tray | |
| JESD-609 Code | e1 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 169Terminations | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Voltage - Supply | 4.5V~5.5V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Supply Voltage | 5V | |
| Terminal Pitch | 0.75mm | |
| Base Part Number | HV583 | |
| JESD-30 Code | S-PBGA-B169 | |
| Function | Serial to Parallel | |
| Output Type | Push-Pull | |
| Logic Function | Shift Register | |
| Logic Type | Shift Register | |
| Number of Bits per Element | 32Bits per Elements | |
| Interface IC Type | INTERFACE CIRCUIT | |
| Supply Voltage1-Nom | 20V | |
| Length | 10mm | |
| Height Seated (Max) | 1.1mm | |
| Width | 10mm | |
| RoHS Status | ROHS3 Compliant |
HV583GA-G Documents
Download datasheets and manufacturer documentation for HV583GA-G
- PCN PackagingMBB/Label Chgs 16/Nov/2018
- ConflictMineralStatementMicrochip-company-68.pdf
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