HUM2010 Tech Specifications

Microchip  HUM2010 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Diode Element Material SILICON
Number of Terminals 1Terminal
RoHS N
Maximum Diode Capacitance 4 pF
Maximum Series Resistance @ Maximum IF 200 mOhms
If - Forward Current 500 mA
Minimum Operating Temperature - 55 C
Maximum Operating Temperature + 150 C
Maximum Operating Frequency 0.5 GHz
Carrier Life 30 us
Ir - Reverse Current 10 uA
Pd - Power Dissipation 13 W
Factory Pack QuantityFactory Pack Quantity 15
Vr - Reverse Voltage 1000 V
Package Style POST/STUD MOUNT
Package Body Material METAL
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 150 °C
Rohs Code No
Manufacturer Part Number HUM2010
Package Shape ROUND
Number of Elements 1 Element
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Risk Rank 5.74
Packaging Reel
JESD-609 Code e4
Pbfree Code No
ECCN Code EAR99
Type High Power Pin Diodes
Terminal Finish GOLD
Applications SWITCHING
Additional Feature HIGH RELIABILITY, LOW DISTORTION
HTS Code 8541.10.00.80
Terminal Position UPPER
Terminal Form UNSPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
JESD-30 Code O-MUPM-X1
Qualification Status Not Qualified
Configuration Single
Diode Type PIN DIODE
Case Connection CATHODE
Breakdown Voltage-Min 1000 V
Reverse Test Voltage 100 V
Diode Capacitance-Nom 3.4 pF
Diode Capacitance-Max 4 pF
Minority Carrier Lifetime-Nom 30 µs
Diode Res Test Current 500 mA
Diode Res Test Frequency 4 MHz
Diode Forward Resistance-Max 0.2 Ω
Vf - Forward Voltage 0.85 V
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