Microchip W3E32M64S-266SBM Memory Connectors Accessories
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W3E32M64S-266SBM Tech Specifications
Microchip W3E32M64S-266SBM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 208Terminals | |
| Manufacturer Part Number | W3E32M64S-266SBM | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Risk Rank | 5.22 | |
| Access Time-Max | 0.75 ns | |
| Number of Words | 33554432 wordsWord | |
| Number of Words Code | 32000000Words Codes | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-609 Code | e0 | |
| Pbfree Code | No | |
| ECCN Code | EAR99 | |
| Terminal Finish | TIN LEAD | |
| Additional Feature | AUTO REFRESH | |
| HTS Code | 8542.32.00.36 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Reach Compliance Code | compliant | |
| Pin Count | 208 | |
| JESD-30 Code | R-PBGA-B208 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Temperature Grade | MILITARY | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Number of Ports | 1Port | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 32MX64 | |
| Memory Width | 64 | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR DRAM | |
| Access Mode | FOUR BANK PAGE BURST |
Index :
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