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MXPLAD30KP260CAE3 Tech Specifications
Microchip MXPLAD30KP260CAE3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Silver | |
| Number of Terminals | 9Terminals | |
| Body Orientation | Straight | |
| Voltage, Rating | 700VDC/500VAC | |
| Shell Size / Insert Arrangement | 20-16 | |
| Operating Temp Range | -55C to 125C | |
| Termination Method | Crimp | |
| Mounting Styles | Cable | |
| Contact Materials | Copper Alloy | |
| Rad Hardened | No | |
| Contact Classification | (2/7)Signal | |
| Supplier Package | PLAD | |
| Direction Type | Bi-Directional | |
| Mounting | Surface Mount | |
| Usage Level | Military grade | |
| Operating Temperature | -55 to 150 °C | |
| Type | Circular | |
| Gender | RCP | |
| Pin Count | 2 | |
| Number of Contacts | 9(POS)Contact | |
| Contact Gender | PIN | |
| Configuration | Single | |
| Number of Ports | 1(Port)Port | |
| Family | ACC | |
| Test Current | 5 mA | |
| Screening Level | Military | |
| ESD Protection | Yes | |
| Shell Plating | Cadmium | |
| Strain Relief | No | 
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