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MXPLAD30KP200CA Tech Specifications

Microchip  MXPLAD30KP200CA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Number of Pins 20Pins
Housing Material --
Contact Material - Mating --
Contact Material - Post Brass
Board Material FR4 Epoxy Glass
Lead Free Status / RoHS Status --
Contact Finish Mating --
Supplier Package PLAD
Peak Pulse Power Dissipation 250 W
Direction Type Bi-Directional
Mounting Surface Mount
Usage Level Military grade
Operating Temperature --
Series Correct-A-Chip® 351000
Part Status Active
Moisture Sensitivity Level (MSL) --
Termination Solder
Pitch - Mating 0.026 (0.65mm)
Pin Count 2
Contact Finish - Post Tin-Lead
Configuration Single
Test Current 5 mA
Screening Level Military
Termination Post Length 0.125 (3.18mm)
Pitch - Post 0.100 (2.54mm)
ESD Protection Yes
Convert From (Adapter End) SSOP
Convert To (Adapter End) DIP, 0.3 (7.62mm) Row Spacing
Features --
Contact Finish Thickness - Mating --
Contact Finish Thickness - Post 200.0µin (5.08µm)
Material Flammability Rating --
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