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M2S150T-1FC1152I Tech Specifications
Microchip M2S150T-1FC1152I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Contact Plating | Gold | |
Package / Case | 1152-BBGA, FCBGA | |
Surface Mount | YES | |
Supplier Device Package | 1152-FCBGA (35x35) | |
Number of Terminals | 15Terminals | |
Body Orientation | Right Angle | |
Termination Method | Solder | |
Base/Housing Material | PCT (Polychlorinated Terphenyl) | |
Contact Materials | Copper Alloy | |
Typical Operating Supply Voltage | 1.2 V | |
Minimum Operating Supply Voltage | 1.14 V | |
Maximum Operating Supply Voltage | 1.26 V | |
Number of I/Os | 574I/Os | |
Package | Tray | |
Base Product Number | M2S150 | |
Mfr | Microchip Technology | |
Product Status | Active | |
Moisture Sensitive | Yes | |
L1 Cache Instruction Memory | - | |
Maximum Clock Frequency | 166 MHz | |
Number of Logic Elements | 146124 LELogic Element | |
Unit Weight | 1.234218 oz | |
Factory Pack QuantityFactory Pack Quantity | 24 | |
Mounting Styles | SMD/SMT | |
Number of Logic Array Blocks - LABs | 12177 LABLogic Array Blocks - LAB | |
Manufacturer | Microchip | |
Brand | Microchip Technology / Atmel | |
RoHS | N | |
L1 Cache Data Memory | - | |
Data RAM Size | 64 kB | |
Package Description | BGA, BGA1152,34X34,40 | |
Package Style | GRID ARRAY | |
Package Body Material | PLASTIC/EPOXY | |
Package Equivalence Code | BGA1152,34X34,40 | |
Supply Voltage-Nom | 1.2 V | |
Reflow Temperature-Max (s) | 30 | |
Supply Voltage-Min | 1.14 V | |
Rohs Code | No | |
Manufacturer Part Number | M2S150T-1FC1152I | |
Package Code | BGA | |
Package Shape | SQUARE | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROSEMI CORP | |
Supply Voltage-Max | 1.26 V | |
Risk Rank | 5.81 | |
Operating Temperature | -55 to 125 °C | |
Series | SmartFusion®2 | |
Packaging | Tray | |
JESD-609 Code | e0 | |
Type | D-Subminiature | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Gender | Receptacle | |
HTS Code | 8542.39.00.01 | |
Subcategory | SOC - Systems on a Chip | |
Technology | CMOS | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Peak Reflow Temperature (Cel) | 240 | |
Terminal Pitch | 1 mm | |
Reach Compliance Code | not_compliant | |
Pin Count | 1152 | |
JESD-30 Code | S-PBGA-B1152 | |
Number of Outputs | 574Outputs | |
Qualification Status | Not Qualified | |
Number of Contacts | 15 POSContact | |
Power Supplies | 1.2 V | |
Number of Ports | 1Port | |
Speed | 166MHz | |
RAM Size | 64KB | |
Core Processor | ARM® Cortex®-M3 | |
Peripherals | DDR, PCIe, SERDES | |
Program Memory Size | 512 kB | |
Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
Architecture | MCU, FPGA | |
Number of Inputs | 574Inputs | |
Seated Height-Max | 2.9 mm | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Product Type | SoC FPGA | |
Speed Grade | 1 | |
Primary Attributes | FPGA - 150K Logic Modules | |
Number of Logic Cells | 146124Logic Cells | |
Number of Cores | 1 CoreCore | |
Flash Size | 512KB | |
Product Category | SoC FPGA | |
Width | 35 mm | |
Length | 35 mm |
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