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DSPIC33EP128GS702T-E/MM Tech Specifications

Microchip  DSPIC33EP128GS702T-E/MM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Surface Mount YES
Number of Terminals 28Terminals
Manufacturer Part Number DSPIC33EP128GS702T-E/MM
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Package Description QFN-S-28
Risk Rank 5.3
Clock Frequency-Max 60 MHz
Number of I/O Lines 20I/O Lines
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC28,.24SQ,25
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
RAM(byte) 8192
ROM(word) 43690
Supply Voltage-Max 3.6 V
Supply Voltage-Nom 3.3 V
Supply Voltage-Min 3 V
Usage Level Automotive grade
Terminal Position QUAD
Terminal Form NO LEAD
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
JESD-30 Code S-PQCC-N28
Temperature Grade AUTOMOTIVE
Speed 70 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 75 mA
Bit Size 16
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
Seated Height-Max 1 mm
Address Bus Width 16
On Chip Program ROM Width 24
CPU Family PIC
Boundary Scan YES
Low Power Mode YES
Screening Level AEC-Q100; TS 16949
Format FIXED POINT
Integrated Cache NO
RAM (words) 4096
Number of Timers 5Timers
ROM Programmability FLASH
Number of External Interrupts 4External Interrupts
On Chip Data RAM Width 16
Length 6 mm
Width 6 mm
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