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AC89D55A Tech Specifications
Microchip AC89D55A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Panel Mount | |
| Mounting Feature | Bulkhead - Front Side Nut | |
| Shell Material | Aluminum | |
| Insert Material | Thermoplastic | |
| Backshell Material, Plating | - | |
| Voltage, Rating | - | |
| Package | Bulk | |
| Primary Material | Metal | |
| Base Product Number | TVS07RF | |
| Mfr | Amphenol Aerospace Operations | |
| Product Status | Active | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Gold | |
| For Use With | MCU XPRO boards | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Manufacturer | Microchip | |
| Brand | Microchip Technology | |
| Operating Temperature | -65°C ~ 200°C | |
| Series | MIL-DTL-38999 Series III, Tri-Start™ TV | |
| Termination | Crimp | |
| Connector Type | Receptacle, Male Pins | |
| Type | - | |
| Number of Positions | 43Positions | |
| Color | Silver | |
| Applications | Aviation, Marine, Military | |
| Fastening Type | Threaded | |
| Subcategory | Development Tools | |
| Current Rating (Amps) | - | |
| Orientation | A | |
| Shielding | Shielded | |
| Ingress Protection | Environment Resistant | |
| Shell Finish | Electroless Nickel | |
| Shell Size - Insert | 25-43 | |
| Function | - | |
| Shell Size, MIL | - | |
| Cable Opening | - | |
| Utilized IC / Part | AC89D55A | |
| Product Type | Development Boards & Kits - Other Processors | |
| Core Architecture | - | |
| Contents | Board(s) | |
| Platform | Xplained Pro | |
| Product | Evaluation Kits | |
| Features | - | |
| Kit Contents | T9-XPRO Board with XPRO Female Connector | |
| Product Category | Development Boards & Kits - Other Processors | |
| Contact Finish Thickness - Mating | 100.0µin (2.54µm) | |
| Material Flammability Rating | - |
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